• About MACMIC
  • Corporate Culture
  • Milestone
  • Marketing Network (Global)
  • Intelligent manufacturing
  • Laboratory

About MACMIC

MACMIC was founded in 2006. Its main business is the R&D, manufacturing and sales of power semiconductor devices. The main products of MACMIC are IGBT, MOSFET, FRED, SiC chips, discrete devices and modules. MACMIC has advanced IGBT and FRED technologies. MACMIC focuses on becoming an expert in providing power semiconductor device solutions. It is one of the leading companies in the power semiconductor industry in China. In 2021, MACMIC was successfully listed on the Shanghai Science and Technology Innovation Board with stock ticker 688711.



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    BUSINESS SCOPES

    • Design, development, manufacturing, and marketing of new types of power semiconductor devices, i.e.IGBT, MOSFET, FRED chips and discrete devices , standard and customer specific power modules (CSPM).

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    QUALITY MANAGEMENT SYSTEMS

    • Insisting on independent innovation, scientific mangement and continuous improvement, providing better products and services to meet and exceed customers' requirements and expectations. The entire production process is controlled by the ISO9001 and IATF 16949 quality management systems. Every production step is strictly checked and tested to ensure the quality and stability of the products.

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    COMPANY GOALS

    • Independent innovation, design, development and manufacturing of world-class IGBT, MOSFET, FRED discretes and modules, to provide solutions of power semiconductor devices.

Corporate Culture

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Corporate Spirit
Great ambitions are achieved through attention to the smallest details.
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Corporate Vision
Starting from the core, driving the future.
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Corporate Mission
Enhancing power efficiency and improving power quality.
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Corporate Purpose
To become an expert in providing power semiconductor device solutions!

Milestone

  • 2006 -2010
    • 2006-08

      MacMic established

    • 2006-11

      Establish reliability lab

    • 2007-05

      M1d FRED released

    • 2007-12

      Huashan plant (Fab I) enter into production

    • 2008-04

      ISO9001-20000 certified

    • 2009-10

      M2d FRED FU series released

    • 2009-10

      First 1700V FRED released

    • 2010-11

      First customer-specific MOS IPM modules released

  • 2011 -2015
    • 2011-06

      M1i NPT IGBT released

    • 2012-06

      First MOSFET modules released

    • 2014-07

      M2i Trench-FS IGBT released

    • 2015-01

      Listed on the NEEQ Market

  • 2016 -2020
    • 2016-11

      First automotive MOSFET modules released

    • 2017-08

      BGBM established

    • 2018-05

      Serialization of M3i IGBT chips and modules

    • 2018-07

      1200V RC IGBT released

    • 2018-10

      First 1700V IGBT modules released

    • 2018-11

      M3d FRED FC series released

    • 2019-01

      M4d FRED FT series released

    • 2020-03

      M5d FRED FT series released

    • 2020-08

      M4i MPT IGBT released

  • 2021 -2022
    • 2021-04

      First automotive-qualified IGBT modules released

    • 2021-07

      Xinzhu Plant (Fab 2) enter into production

    • 2021-09

      Listed on SSE STAR Market

    • 2022-02

      M5i MPT IGBT released

    • 2022-03

      M6d FRED FH series released

    • 2022-03

      First automated production line set-up for automotive-grade IGBT modules

    • 2022-05

      M6i IGBT released

    • 2022-05

      First automated production line set-up for Easy modules

    • 2022-11

      M7i IGBT released

    • 2022-12

      M7d FRED FT series released

  • 2023 -2024
    • 2023-01

      First SiC SBD chips released

    • 2023-03

      8-inch 1700V FWD PTC series released

    • 2023-03

      Serialization of 1700V MacMic chip IGBT modules

    • 2023-05

      Core Energy (subsidiary) established

    • 2023-06

      Xinzhu plant (Fab 3) enter into production

    • 2023-06

      First automated production line set-up for PV modules

    • 2023-09

      First SiC MOS chips released

    • 2023-10

      CNAS Certified

    • 2023-10

      First production line set-up for SiC modules

  • 2006-2010
    Start-up
  • 2011-2015
    Exploratory Period
  • 2016-2020
    Developing Period
  • 2021-2022
    Rapid Developing Period
  • 2023-2024
    Rapid Developing Period

Marketing Network (Global)

China India Germany Italy Turkey Russia Korea US Brazil S.Africa Singapore

Intelligent manufacturing

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    Die Attach & DBC Attach
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    Soldering
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    Testing
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    Ultrasonic welding
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    Gel Potting
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    Production lines
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    Core Energy Production Line
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    Die Attach & DBC Attach
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    Soldering
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    Testing
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    Ultrasonic welding
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    Gel Potting
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    Production lines
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    Core Energy Production Line
  • 贴片机.jpg
    Die Attach & DBC Attach
  • 一次焊接.jpg
    Soldering
  • 测试自动化.jpg
    Testing
  • 超声焊.jpg
    Ultrasonic welding
  • 灌胶 - 副本.png
    Gel Potting
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    Production lines
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    Core Energy Production Line

Laboratory

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CNAS Certified
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Testing Equipments
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Characterization Testing
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Reliability Testing
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Application Testing